Method of forming hole in glass substrate by using pulsed laser, and method of producing glass substrate provided with hole
US10442720B2 · kind B2 · utility
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6References
20Claims
0Family size
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Key dates
| Filing date | Sep 27, 2016 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Nov 2, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.