Heat pump
US10443900B2 · kind B2 · utility
2Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2016 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Jan 23, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2600/2501
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Embodiments as disclosed herein are directed to a heat pump that employs at least two different refrigerants, each of which is optimized for either a cooling operation mode or a heating operation mode. The embodiments as disclosed herein can help increase the capacity and/or efficiency of a heat pump in both the cooling operation mode and the heating operation mode. In addition, the embodiments as disclosed herein may also eliminate the need for a ground source in a relatively low ambient temperature environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.