Patent · US Active

Integral heat exchanger manifold guide vanes and supports

US10443959B2 · kind B2 · utility

6Cited by
4References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 16, 2018
Grant dateOct 15, 2019
Priority date
Expiry dateMar 16, 2038

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF28F2009/029
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

An embodiment of a heat exchanger according to the disclosure includes a core configured to receive and place a plurality of mediums in at least one heat exchange relationship, and a first manifold connected to and in fluid communication with the core at a first manifold/core interface. The first manifold includes a first end distal from the core with at least one port adapted to receive or discharge a first medium of the plurality of mediums, and a second end joined to the core at the first manifold/core interface adapted to transfer the first medium to or from a plurality of first heat exchange passages in the core. A plurality of first guide vanes in the manifold defining individual layers for the first medium, and a plurality of second guide vanes divide ones of the individual layers into a plurality of first discrete manifold flow passages extending at least part of a distance from the first end to the second end of the first manifold.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.