Wafer-level fabrication of optical devices with front focal length correction
US10444477B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2012 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Jun 9, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The wafer stack (100) comprises a first wafer (OW1) referred to as optics wafer and a second wafer (SW) referred to as spacer wafer, said optics wafer (OW1) having manufacturing irregularities. The spacer wafer (SW) is structured such that it at least partially compensates for said manufacturing irregularities. The corresponding method for manufacturing a device, which in particular can be an optical device, comprises carrying out a correction step for at least partially compensating for manufacturing irregularities. Such a correction step comprises providing a wafer (SW) referred to as spacer wafer, wherein that spacer wafer is structured for at least partially compensating for said manufacturing irregularities. Those manufacturing irregularities may comprise a deviation from a nominal value, e.g., a irregularities in focal length. The invention can allow to mass produce high-precision devices at a high yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.