Patent · US Active

Device for machining material by means of laser radiation

US10444521B2 · kind B2 · utility

1Cited by

3References

19Claims

0Family size

Assignee

Precitec GmbH & Co. KG · DE

Inventors

Andreas Rudolf · Würzburg, DE
Martin Schönleber · Aschaffenburg, DE

Key dates

Filing date	Jan 27, 2016
Grant date	Oct 15, 2019
Priority date	—
Expiry date	Jan 27, 2036

Classification

Technology area (CPC G)Physics
CPC primaryG02B27/4255
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A device for machining material by means of laser radiation, including a focusing optics for focusing a laser beam onto a workpiece and an adjusting optics for adjusting the intensity distribution comprising at least two plate-shaped optical elements which are arranged one behind the other in the beam path of the laser beam, which are rotatable relative to one another in the circumferential direction, and which each have a surface with a circular pattern of sector-shaped facets which, in the circumferential direction, are alternately inclined with respect to the respective plate plane.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.