Fingerprint identification device, mobile device using the same and method for manufacturing fingerprint identification device
US10445551B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2017 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Dec 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8057
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint identification device and a method for manufacturing the fingerprint identification device are provided. The fingerprint identification device includes a solder ball array, a re-distribution layer, an image sensing integrated circuit (IC), a light emitting circuit, a photic layer and a molding material. The re-distribution layer disposed on the solder ball array is electrically connected to a plurality of solder balls. The image sensing IC includes a plurality of through silicon vias (TSVs), and the TSVs are correspondingly electrically connected to the solder balls, respectively, through the re-distribution layer. The light emitting circuit is disposed on one side of the image sensing IC, and electrically connected to the image sensing IC through the re-distribution layer. The image sensing IC controls the light emitting circuit. The photic layer is disposed on the image sensing IC. The molding material encloses the image sensing IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.