Electronic component having multilayer capacitor, interposer, and adhesive layer
US10446323B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2018 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Nov 13, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, an interposer including an interposer body and a pair of external terminals, and an adhesive layer disposed on facing boundaries of the multilayer capacitor and the interposer; wherein the external terminals include bonding portions disposed on a top surface of the interposer body and connected to the external electrodes via the adhesive layer, mounting portions disposed on a bottom surface of the interposer body, and connection portions disposed on end surfaces of the interposer body to connect the bonding portions and the mounting portions to each other; wherein 0.1≤t/T≤0.3 in which dimension “t” is a maximum height of the adhesive layer and dimension “T” is a height of the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.