Method for attaching wiring protective film layer, wiring structure and display panel
US10446413B2 · kind B2 · utility
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0References
15Claims
0Family size
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Key dates
| Filing date | Jun 22, 2017 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Jun 22, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2201/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a method for attaching a wiring protective film layer, a wiring structure and a display panel. The attaching method comprises: forming a protective structure comprising a protective film layer and a carrier layer disposed in stack on a wiring layer, wherein the wiring layer and the protective film layer are in contact; and removing the carrier layer and remaining the protective film layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.