Electronic device and semiconductor device
US10446531B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2014 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Feb 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19102
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a first wiring substrate and a semiconductor device mounted on the first wiring substrate. A plurality of first semiconductor chips and a second semiconductor chip which controls each of the plurality of first semiconductor chips are mounted side by side on a second wiring substrate of the semiconductor device. Further, the plurality of first semiconductor chips are mounted between a first substrate side of the wiring substrate and an extension line of a first chip side of the second semiconductor chip. Furthermore, the first wiring substrate includes a first power line which supplies a first power potential to each of the plurality of first semiconductor chips and a second power line which supplies a second power potential to the second semiconductor chip and has a width larger than that of the first power line. Also, the second power line intersects the first substrate side of the second wiring substrate and extends from a side of the first substrate side of the second wiring substrate toward the second semiconductor chip when seen in a plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.