Hermetic electronic-component package, in particular for an image sensor
US10446597B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2018 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Apr 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a hermetic integrated-circuit package, the peripheral wall that bounds the cavity 2 containing the integrated circuit has, all the length of the peripheral wall, a surface containing a relief, which is defined by a raised planar zone z1, on the side inside the package of the cavity, and a recessed zone z2, on the exterior of the raised planar zone. The planar zone makes direct contact with the closing plate 6 of the package, without interposition of adhesive, over the entire length of the peripheral wall, except where planarity defects prevent the contact. The recessed zone does not make direct contact with the closing plate, and contains an adhesive bead that joins the closing plate and the upper portion of the peripheral wall over all the peripheral length of the latter. The adhesive bead 9 has a surface Se in open air between the closing plate and the recessed zone, on the exterior side of the package. This surface serves as an exchange surface with the exterior atmosphere of the package, in case of adhesive degassing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.