Electronic device having a composite structure
US10447834B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2017 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | May 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/0283
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.