Method for forming interconnections between electronic devices embedded in textile fibers
US10448680B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 12, 2017 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | May 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W4/00
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for forming interconnections between electronic devices embedded in a textile includes weaving a textile panel including at least one smart fiber having an electronic device embedded in a central portion thereof and at least one electrically conducting filament proximal to an outer boundary thereof. While the panel is in the weaving machine, fiducials not visible to the eye are created in the panel that are correlated in location with the smart fiber(s). After removing the textile panel from the weaving machine, machine detection is used to locate the fiducials, thereby mapping distortions of the fiber pattern. An interconnect pattern is transformed to match the distorted fiber pattern of the conducting fibers, and is applied to the textile panel to form an electrical connection with the electronic device(s). The fiducials can include infra-red phosphors. Vias can be formed to provide electrical access to the conducting filament(s).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.