Moldable adhesive wafers
US10449082B2 · kind B2 · utility
25Cited by
41References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 23, 2014 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | Mar 3, 2036 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61L24/001
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Disclosed herein are methods and devices for coupling and securing a medical device appliance. In particular, one piece moldable adhesive structures are disclosed which allow customization of an attachment wafer to the size and shape of, for example, a stoma, while allowing flexibility and security for attaching a medical device, such as an ostomy pouch or other device to the subject.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.