Masking substrates for application of protective coatings
US10449568B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2014 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | Jan 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09872
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.