Die-cut patterns for blister package
US10450126B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2013 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | Sep 1, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D2575/3227
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A blister package is formed for retaining individual products. The package includes a receptacle substrate having a sealing flange and at least one receiving cell formed to retain product therein. A polymer top layer covers the cell and a portion thereof is sealed to the sealing flange. A score pattern is formed in at least one surface of the top layer and overlapping the cell. The score pattern is defined by a first plurality of score lines formed in a repeating pattern and a second plurality of score lines formed in a repeating pattern. The first and second plurality of rows overlap one another to define a plurality of intersections, with the overall score line pattern having a total linear length of the score lines per cell of at least 5 inches and a total number of score line intersections per cell of at least 10.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.