Dielectric composition, dielectric element, electronic component and laminated electronic component
US10450234B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2016 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | Jun 16, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2235/80
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A dielectric composition, a dielectric element, an electronic component and a laminated electronic component are disclosed. In an embodiment a dielectric composition includes particles comprising a perovskite crystal structure including at least Bi, Na, Sr and Ti and at least one element selected from the group consisting of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Yb, Ba, Ca, Mg and Zn, wherein a content of the element is between 0.5 molar pails and 11.1 molar parts, defining a Ti content of the dielectric composition as 100 molar parts, wherein 0.17≤α≤2.83, where α is a molar ratio of Bi with respect to Sr in the dielectric composition, wherein at least some of the particles include a low-Bi phase, and wherein a total surface area of the low-Bi phase within the particles is between 0.1% and 15% of the total surface area of the particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.