Solid state cooling device
US10451321B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 1, 2017 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | Apr 18, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
This invention relates to a cooling device which utilizes both thermoelectric and magnetocaloric mechanisms for enhanced cooling applications. Using high thermal conductivity magnetocaloric composites in conjunction with thermoelectric elements acting as thermal switches which are electrically coupled to a magnetization and demagnetization cycle enables the use of larger quantities of magnetocaloric material, and high efficiency solid state cooling can be achieved. Solid state cooling devices are useful for a variety of industrial applications which require cooling, such as, but not limited to cooling of microelectronic devices, cooling on space platforms, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.