Microscale sensors for direct metrology of additively manufactured features
US10451539B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 2, 2018 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | Mar 2, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0286
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This invention relates to a microelectromechanical device for mechanical characterization of a specimen. In one embodiment the device may incorporate a substrate, at least one first flexure bearing and at least one second flexure bearing, both being supported on the substrate. First and second movable shuttles may be used which are supported above the substrate by the flexure bearings so that each is free to move linearly relative to the substrate. Ends of the movable shuttles are separated by a gap. A thermal actuator may be connected to one end of the first movable shuttle, and operates to cause the first movable shuttle to move in a direction parallel to the surface of the substrate in response to a signal applied to the thermal actuator. A first capacitive sensor may be formed between the first movable shuttle and the substrate, and a second capacitive sensor formed between the second movable shuttle and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.