Hydrophobic, conductive organic materials for metallic surfaces
US10453584B2 · kind B2 · utility
1Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2016 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | Jun 17, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C30/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process of forming a hydrophobic, conductive barrier on a metallic surface includes coating the metallic surface with an organic, conductive material. The organic, conductive material includes a conductive group having two or more alkyne groups and a terminal thio group to bind the organic, conductive material to the metallic surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.