Semiconductor device
US10453776B2 · kind B2 · utility
4Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2016 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | Nov 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor module including a semiconductor element, a passive element, a cooling member, a first conductive member and a second conductive member. The cooling member is disposed between the semiconductor module and the passive element. And a first conductive member and a second conductive member electrically connect the semiconductor module and the passive element. Furthermore, two or more aspects of at least one of the first conductive member and the second conductive member face the cooling member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.