Patent · US Active

Method of producing an optoelectronic component

US10454240B2 · kind B2 · utility

0Cited by

0References

11Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Christoph Walter · Stuttgart, DE
Roland Enzmann · Regensburg, DE
Markus Horn · Straubing, DE
Jan Seidenfaden · Neumarkt i.d.OPf., DE

Key dates

Filing date	Sep 15, 2016
Grant date	Oct 22, 2019
Priority date	—
Expiry date	Sep 15, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/8581
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.