Modular cooling
US10455726B2 · kind B2 · utility
4Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2014 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | Sep 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2079
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.