Enclosure cooling system
US10455729B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 23, 2017 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | Mar 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In one embodiment, the invention can be a system for cooling an enclosure enclosing electrical components and configured to prevent air and exhaust from escaping the enclosure. The system can include a heat sink comprising a heat exchanger, and a tube extending into and out of the heat exchanger, the tube configured to transport liquid through the heat exchanger. The system can further include a fan configured to push air heated by electrical components onto the heat exchanger. The heat exchanger can be configured to receive heat from air pushed by the fan, and transfer the received heat to the liquid being transported by the tube through the heat exchanger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.