Method of profile heatsealing
US10456291B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2017 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Jun 10, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1028
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This application relates to a method of covering a pessary device for relief of female incontinence with an overwrap. More particularly, the present invention relates to methods of conforming the overwrap to the pessary device using a sealing mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.