Patent · US Active

Method for producing a soldered connection

US10456870B2 · kind B2 · utility

0Cited by

5References

15Claims

0Family size

Assignee

HERAEUS DEUTSCHLAND GMBH & CO. KG · DE

Inventors

Sebastian Fritzsche · Hanau, DE
Jurgen Schulze · Potsdam, DE
Jörg Trodler · Königs Wusterhausen, DE

Key dates

Filing date	Aug 21, 2015
Grant date	Oct 29, 2019
Priority date	—
Expiry date	Feb 3, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/8384
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for making a firmly-bonded connection involves a) providing an electronic component and a substrate having surfaces to be connected; b) applying a copper paste onto at least one of the surfaces and drying the layer of copper paste; c1) applying a solder agent onto the copper paste and arranging the component and the substrate in contact via the combination of copper paste and solder agent; or c2) arranging the component and the substrate in contact via the dried copper paste, and applying a solder agent next to the layer of dried copper paste; and d) soldering the arrangement. The copper paste contains (i) particles of copper, copper-rich copper/zinc alloy, and/or copper-rich copper/tin alloy containing a phosphorus fraction of 0 to ≤500 wt-ppm, (ii) solder particles which are tin, tin-rich tin/copper alloy, tin-rich tin/silver alloy, and/or tin-rich tin/copper/silver alloy, and (iii) vehicle.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.