Patent · US Active

Solder paste

US10456871B2 · kind B2 · utility

0Cited by

1References

12Claims

0Family size

Assignee

HERAEUS DEUTSCHLAND GMBH & CO. KG · DE

Inventors

Sebastian Fritzsche · Hanau, DE
Jurgen Schulze · Potsdam, DE
Jörg Trodler · Königs Wusterhausen, DE

Key dates

Filing date	Aug 21, 2015
Grant date	Oct 29, 2019
Priority date	—
Expiry date	Jan 6, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10174
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ≤500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ≤15 μm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.