Shear cutter with improved wear resistance of WC—Co substrate
US10456889B2 · kind B2 · utility
0Cited by
11References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2016 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Jan 7, 2037 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/573
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A cutting element may be formed by sintering together a plurality of metal carbide grains and a metal binder to form a substrate, forming at least one binder gradient in the substrate, and mounting an abrasive layer to the substrate at an interface. The concentration of metal binder material may decrease along at least one direction to form the at least one binder gradient.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.