Bonding apparatus and bonding method
US10456961B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2015 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Aug 28, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/3644
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The bonding apparatus of the present invention is an apparatus that bonds a patch containing a reinforcing fiber to a bonded section of a corner section CR of an object member. The bonding apparatus has s heater mat, a pushing member, a bag member having a decompression port, a mold releasing film, a breather, a heater mat and a sealant. A pushing member has a first cowl plate, a second cowl plate and an elastic pressuring body. A pressuring section of the pushing member has the surface shape corresponding to a corner section design value after the patch is bonded. By protruding from a gap between a first cowl plate and a second cowl plate to a direction of the corner section CR, the patch is pushed to the bonded section and the generation of a wrinkle in the reinforcing fiber can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.