Multi-layer, stress-isolation platform for a MEMS die
US10457547B2 · kind B2 · utility
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5References
20Claims
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Key dates
| Filing date | Feb 14, 2018 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Feb 14, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/035
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A multi-layer, stress-isolation platform configured for attaching a MEMS die to a base includes a first platform, a first layer of attachment material between the base and the first platform and attaching the first platform to the base, a MEMS die, and a second layer of attachment material between the first platform and the MEMS die and attaching the MEMS die to the first platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.