Patent · US Active

Lead-through or connecting element with improved thermal loading capability

US10457588B2 · kind B2 · utility

0Cited by

6References

13Claims

0Family size

Assignee

Schott AG · DE

Inventors

Oliver Fritz · Landshut, DE
Georg Meier · Obersüßbach, DE
Thomas Fink · Tipp City, US

Key dates

Filing date	Oct 18, 2018
Grant date	Oct 29, 2019
Priority date	—
Expiry date	Oct 18, 2038

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC03C2204/00
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A lead-through or connecting element is provided that includes an assembly having a carrier body of a high-temperature alloy, a functional element, and an at least partially crystallized glass. The crystallized glass is between a portion of the functional element and a portion of the carrier body. The carrier body subjects the crystallized glass to a compressive stress of greater than or equal to zero, at a temperature from at least 20° C. to more than 450° C. Also provided are a method for producing a lead-through or connecting element, the use of such a lead-through or connecting element, and to a measuring device including such a lead-through or connecting element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.