Laser welded glass packages

US10457595B2 · kind B2 · utility

Assignee

• CORNING INCORPORATED · US

Inventors

• Heather Debra Boek · Corning, US
• Leonard Charles Dabich, II · Riverside, US
• David Alan Deneka · Corning, US
• Jin Su Kim · Riverside, US
• Shari Elizabeth Koval · Corning, US
• Stephan Lvovich Logunov · Corning, US
• Mark Alejandro Quesada · Horseheads, US
• Alexander Mikhailovich Streltsov · Corning, US

Key dates

• Filing date: Oct 29, 2015
• Grant date: Oct 29, 2019
• Expiry date: Jul 13, 2036

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C03C27/10
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σtensile stress location)/(σinterface laser weld))<<1 or <1 and σinterface laser weld>10 MPa or >1 MPa where σtensile stress location is the stress present in the first substrate and σinterface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.