Multilayer ceramic substrate and electronic device
US10457608B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 7, 2018 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Nov 10, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/068
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A multilayer ceramic substrate that includes a surface layer portion positioned on an internal layer portion, and a surface layer electrode on a surface of the surface layer portion. The surface layer portion includes a first layer next to the internal layer portion, and the internal layer portion includes a second layer next to the first layer. The thermal expansion coefficient of the first layer is lower than the thermal expansion coefficient of the second layer. The first layer and the second layer each contain glass containing 40 weight % to 65 weight % of MO, where MO is at least one selected from CaO, MgO, SrO, and/or BaO); 35 weight % to 60 weight % of alumina, and 1 weight % to 10 weight % of at least one metal oxide selected from CuO and/or Ag2O.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.