Thermally conductive resin molded article
US10457845B2 · kind B2 · utility
2Cited by
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7Claims
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Assignee
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Key dates
| Filing date | Aug 21, 2015 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Aug 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive resin molded article having a resin and a thermally conductive filler is provided. The thermally conductive filler is oriented substantially in the thickness direction of the thermally conductive resin molded article. The volumetric filling factor of the thermally conductive filler in the thermally conductive resin molded article is 20-80% by volume. Weld lines in the resin are formed substantially in the thickness direction of the thermally conductive resin molded article. An oil component is included in the thermally conductive resin molded article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.