Anodization of bonded assembly
US10458035B2 · kind B2 · utility
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4References
18Claims
0Family size
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Key dates
| Filing date | Jul 21, 2017 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Aug 7, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2300/6111
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for anodizing a bonded assembly may include attaching a first electrode to a first component of the bonded assembly, and forming a first oxide layer on the first component. The bonded assembly may comprise the first component and a second component bonded to the first component. The second component may be electrically isolated from the first component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.