Vapor compression system
US10458687B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2017 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Jan 5, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/70
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Embodiments of the present disclosure relate to a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system that includes a refrigerant loop, a compressor disposed along the refrigerant loop and configured to circulate refrigerant through the refrigerant loop, and an evaporator disposed along the refrigerant loop and configured to place the refrigerant in thermal communication with a cooling fluid, where the refrigerant surrounds a tube bundle disposed in the evaporator, the tube bundle is configured to flow the cooling fluid, and the evaporator has a height based at least on a target height of a liquid level of refrigerant in the evaporator, the evaporator includes a discharge configured to direct the vapor refrigerant from the evaporator to an inlet of the compressor, and an interface between the discharge and the inlet is without a bend.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.