Light emitting device manufacturing method and apparatus thereof
US10461139B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 5, 2018 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Sep 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
Abstract
A method of manufacturing a light emitting device includes providing a substrate, forming a plurality of photosensitive bumps over the substrate, forming a photosensitive layer over the plurality of photosensitive bumps, forming a buffer layer between the photosensitive layer and the plurality of photosensitive bumps, patterning the photosensitive layer to form a recess through the photosensitive layer to expose a surface, disposing an organic emissive layer on the surface, forming a metal containing layer over the organic emissive layer, and removing the patterned photosensitive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.