Method for depositing protection film of light-emitting element
US10461282B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Nov 13, 2018 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Nov 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method of depositing a protection film for a light-emitting element, the method comprising the steps of: depositing a first inorganic protection layer on a light-emitting element on a substrate; and depositing a second inorganic protection layer, having comparatively smaller internal stress than the first inorganic protection layer, on the first inorganic protection layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.