Converter and manufacturing method thereof
US10461389B2 · kind B2 · utility
2Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2017 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Oct 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P11/005
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a converter includes a first dielectric substrate; a second dielectric substrate provided above the first dielectric substrate through a first adhesive layer; a first signal line provided between the first dielectric substrate and the second dielectric substrate; a first via that penetrates the first dielectric substrate and is coupled to the first signal line on an upper side of the first via; and a first conductor plate provided at least one of below the first dielectric substrate and above the second dielectric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.