Microwave modulation device
US10461412B2 · kind B2 · utility
1Cited by
0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2018 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Feb 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/50
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A microwave modulation device includes a first radiator, a second radiator and a modulation structure. The first radiator includes a substrate; a metal layer disposed on the substrate; a protective layer disposed on at least a portion of the metal layer and including a through hole overlapping with at least a portion of the metal layer; and an etch stop layer disposed between the metal layer and the protective layer. The second radiator disposed corresponding to the first radiator. The modulation structure is disposed between the first radiator and the second radiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.