Driver assemblies, headphones including driver assemblies, and related methods
US10462560B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2018 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Jan 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2400/07
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A driver assembly comprises a housing structure, a magnet assembly within the housing structure, and opposing spring structures coupled to the housing structure at different vertical positions than one another. The magnet assembly comprises a permanent magnet, a plate structure underlying the permanent magnet, a voice coil circumscribing the permanent magnet and the plate structure, and a yoke structure at least partially surrounding the permanent magnet, the plate structure, and the voice coil. The opposing spring structures are configured to impede horizontal movement of the permanent magnet, the plate structure, and the yoke structure while permitting vertical movement thereof. A headphone and a method of forming a headphone are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.