Heat sink assembly
US10462941B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2017 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Feb 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly for a power module is provided. The assembly includes a main body having a first cooling circuit and a second cooling circuit. The first cooling circuit includes a first plurality of channels, at least one first end channel, at least one second end channel, a first inlet, and a first outlet. The first cooling circuit is adapted to provide a first flow of a coolant through the main body. The second cooling circuit includes a second plurality of passages, at least one first end passage, at least one second end passage, a second inlet, and a second outlet. The second cooling circuit is adapted to provide a second flow of the coolant through the main body. The first cooling circuit and second cooling circuit is adapted to provide a cross flow of the first flow and second flow through the main body respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.