Patterning conductive films using variable focal plane to control feature size
US10464172B2 · kind B2 · utility
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30References
21Claims
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Key dates
| Filing date | Feb 21, 2014 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Apr 3, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A processing system directs a laser beam to a composite including a substrate, a conductive layer, and a conductive border. The location of a focus of the laser beam can be controlled to bring the laser beam into focus on the surfaces of the conductive materials. The laser beam can be used to ablatively process the conductive border and non-ablatively process the conductive layer by translating a focus-adjust optical system so as to vary laser beam diameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.