Multilayer composite comprising layers of partly aromatic polyamides

US10464296B2 · kind B2 · utility

Assignee

• EVONIK DEGUSSA GMBH · DE

Inventors

• Jasmin Berger · Dortmund, DE
• Rainer Goering · Borken, DE
• Karl Kuhmann · Schneverdingen, DE

Key dates

• Filing date: Mar 17, 2016
• Grant date: Nov 5, 2019
• Expiry date: Aug 29, 2036

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B32B2597/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A multilayer composite containing the following layers: 1. a first layer (layer I) of a moulding compound containing at least 40 wt. % of the following components: 1) 60 to 99 parts by wt. of a copolyamide based on hexamethylenediamine, terephthalic acid and an aliphatic dicarboxylic acid having 8 to 19 carbon atoms and 2) 40 to 1 parts by wt. of an olefinic copolymer as impact modifier, wherein the parts by wt. of 1) and 2) sum to 100; and II. a second layer (layer II) of a moulding compound containing at least 60 wt. % of a mixture of the following components: 1) 75 to 100 parts by wt. of a partly aromatic copolyamide and 2) 25 to 0 parts by wt. of an olefinic copolymer as impact modifier with the proviso that in the moulding compound of layer II the mixture of components 1) and 2) comprises at least 5 fewer parts by wt, of olefinic copolymer than in the moulding compound of layer I, has a high heat distortion temperature, a very good impact resistance, a high elongation at break and good layer adhesion.