Proximity sensor
US10466073B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2017 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Feb 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A proximity sensor in which generation of voids in a resin sealing portion sealing an inside of a housing can be suppressed and thus a yield is improved. The proximity sensor includes a housing, a detection coil, a circuit board and a resin sealing portion. The circuit board is accommodated in the housing to partition an internal space of the housing, and the resin sealing portion covers at least a part of the circuit board by filling the internal space of the housing and thus seals a covered portion of the circuit board. A resin injection port configured to inject a liquid resin forming the resin sealing portion by curing the liquid resin is provided in the housing, and a cutout portion having a notch shape or an opening shape is provided in the circuit board to include at least a part of a portion facing the resin injection port.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.