Ruggedized wafer level MEMS force sensor with a tolerance trench
US10466119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2016 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Jul 12, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L1/26
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An example MEMS force sensor is described herein. The MEMS force sensor can include a cap for receiving an applied force and a sensor bonded to the cap. A trench and a cavity can be formed in the sensor. The trench can be formed along at least a portion of a peripheral edge of the sensor. The cavity can define an outer wall and a flexible sensing element, and the outer wall can be arranged between the trench and the cavity. The cavity can be sealed between the cap and the sensor. The sensor can also include a sensor element formed on the flexible sensing element. The sensor element can change an electrical characteristic in response to deflection of the flexible sensing element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.