Pressure sensor sub assembly and fabrication
US10466125B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 11, 2016 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | May 23, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L13/026
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A differential pressure sensor includes a first sensor housing member having a first fluid inlet port for receiving a first fluid at a first pressure and a second sensor housing member having a second fluid inlet port for receiving a second fluid at a second pressure. A pressure-sensing subassembly includes a semiconductor pressure-sensing die having a sensitive diaphragm for sensing pressure. The pressure-sensing subassembly is configured for insertion into the differential pressure sensor such that once inserted the first fluid inlet port is in fluid communication with a first surface of the sensitive diaphragm and the second fluid inlet port is in fluid communication with a second surface of the sensitive diaphragm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.