Patent · US Active

Sensor assembly

US10466229B2 · kind B2 · utility

0Cited by

4References

15Claims

0Family size

Assignee

Sensirion AG · CH

Inventors

Matthias Schibli · Männedorf, CH
Daniel Lehmann · Frankfurt, DE

Key dates

Filing date	Jul 28, 2017
Grant date	Nov 5, 2019
Priority date	—
Expiry date	Jul 28, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A sensor assembly comprises a substrate arrangement and a sensor chip mounted to the substrate arrangement. A sensing element is integrated on or in the sensor chip and is sensitive to at least one parameter of a fluid. An access opening is provided in the substrate arrangement enabling the fluid to access the sensing element. A metallization arranged on at least a portion of the substrate arrangement seals a chamber containing the sensor chip which portion comprises one or more of a wall defining the access opening or an area facing the sensor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.