Optical module including silicon photonics chip and coupler chip
US10466433B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2018 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Jun 25, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/428
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module includes a Silicon Photonics chip that transports a light signal and a coupler chip that includes a waveguide and that is attached to the Silicon Photonics chip so that the light signal is transported along a light path between the Silicon Photonics chip and the coupler chip. The light path in the coupler chip includes a guided section that includes the waveguide that guides the light signal and an unguided section that does not guide the light signal in any other waveguide structure. The cross-sectional size of the beam defined by the light signal is largest at the interface between the Silicon Photonics chip and the coupler chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.