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US10466807B1 · kind B1 · utility

3Cited by
13References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 13, 2018
Grant dateNov 5, 2019
Priority date
Expiry dateNov 13, 2038

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06F3/018
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

Systems and methods are involved with but are not limited to a shell component including a first material member and a co-molded second material member, the first material member including a periphery, and one or more curvilinear edge surfaces extended along the periphery, the second material member including one or more portions adjacent one or more portions of the one or more curvilinear edge surfaces, the first material member of a first hardness value, the second material member of a second hardness value less than the first hardness value of the first material member; a key matrix circuit component adjacent one or more portions of a first surface of the first material member; and a plurality of key caps coupled to the key matrix circuit component. In addition, other aspects are described in the claims, drawings, and text forming a part of the present disclosure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.