High density multi node computer with improved efficiency, thermal control, and compute performance
US10467021B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2016 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Mar 7, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A multi-node computer system, comprising: a plurality of nodes, a system control unit and a carrier board. Each node of the plurality of nodes comprises a processor and a memory. The system control unit is responsible for: power management, cooling, workload provisioning, native storage servicing, and I/O. The carrier board comprises a system fabric and a plurality of electrical connections. The electrical connections provide the plurality of nodes with power, management controls, system connectivity between the system control unit and the plurality of nodes, and an external network connection to a user infrastructure. The system control unit and the carrier board provide integrated, shared resources for the plurality of nodes. The multi-node computer system is provided in a single enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.